Investigation of energy loss mechanisms in micromechanical resonators
作者： R.N. Candler , H. Li , M. Lutz , W.-T. Park , A. Partridge
DOI: 10.1109/SENSOR.2003.1215320
关键词:
摘要: Micromechanical resonators with resonant frequencies from 500 kHz to 10 MHz were built and examined for several energy loss mechanisms. Thermoelastic damping, clamping air damping considered. The devices shown be limited by thermoelastic providing experimental verification of this phenomenon at the microscale. Resonators scaled dimensions also matched well scaling theory a given pressure. An mechanism other than dissipation, most likely loss, was dominant whose ratio length width less 10:1. fabricated using single-wafer encapsulation process.
sci-hub.se 参考文章(5)
A. Partridge, A.E. Rice, T.W. Kenny, M. Lutz, New thin film epitaxial polysilicon encapsulation for piezoresistive accelerometers international conference on micro electro mechanical systems. pp. 54- 59 ,(2001) , 10.1109/MEMSYS.2001.906477
W. E. Newell, Miniaturization of tuning forks. Science. ,vol. 161, pp. 1320- 1326 ,(1968) , 10.1126/SCIENCE.161.3848.1320
Ron Lifshitz, M. L. Roukes, Thermoelastic damping in micro- and nanomechanical systems Physical Review B. ,vol. 61, pp. 5600- 5609 ,(2000) , 10.1103/PHYSREVB.61.5600
T.V. Roszhart, The effect of thermoelastic internal friction on the Q of micromachined silicon resonators IEEE 4th Technical Digest on Solid-State Sensor and Actuator Workshop. pp. 13- 16 ,(1990) , 10.1109/SOLSEN.1990.109810
V.T. Srikar, S.D. Senturia, Thermoelastic damping in fine-grained polysilicon flexural beam resonators IEEE\/ASME Journal of Microelectromechanical Systems. ,vol. 11, pp. 499- 504 ,(2002) , 10.1109/JMEMS.2002.802902