Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism
作者： R. Dudek , H. Berek , T. Fritsch , B. Michel
DOI: 10.1109/6144.868845
关键词: Conductive polymer 、 Viscoelasticity 、 Temperature cycling 、 Adhesive 、 Isotropy 、 Materials science 、 Mechanics 、 Shrinkage 、 Epoxy 、 Thermal conduction
摘要: The isotropic conductive adhesive (ICA) mounting technology is of growing interest, but reliability concerns are still preventing its broad application. Reports on environmental testing results related to both high temperature storage and thermal cycling. Additionally, the influence moisture has been investigated for pressure cooker test humidity with exposure times up several weeks. In an ICA, particles embedded in a polymeric matrix material, where they can form paths. This mechanical part mechanism was studied more detail using finite element (FE-) model, because only little information available this subject. A joint chip resistor organic board selected model. not treated as homogeneous split into material idealized particles. dependent viscoelastic constitutive description used model epoxy behavior. diffusion analyzes joints were conducted. contacting shown depend cure shrinkage, changes, swelling effects.
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