Finite element analysis and simulation of adhesive bonding, soldering and brazing—an addendum: a bibliography (1996–2002)
作者： Jaroslav Mackerle
DOI: 10.1088/0965-0393/10/6/304
关键词:
摘要: This paper gives a bibliographical review of the finite element methods (FEMs) applied to analysis and simulation adhesive bonding, soldering brazing. The bibliography is an addendum Finite brazing: a bibliography (1976–96) published in 1997 Modelling Simul. Mater. Sci. Eng. 5 159–85. added at end this article contains 867 references papers conference proceedings on subject that were 1996–2002. following topics are included: adhesive bonding—stress bonding general, stress design specific bonded joints, fracture mechanics fatigue analysis, destructive non-destructive evaluation bonds, other topics; soldering—thermal stresses deformation solder aspects joint reliability; brazing—finite element analysis simulations.
harvard.edu
sci-hub.se 参考文章(365)
Jim B. Surjaatmadja, Finite Element Analysis Shows Screenout Development and Cement Bond Destruction in Horizontal Wells European Petroleum Conference. pp. 65- 72 ,(1996) , 10.2118/36867-MS
Seong-Min Lee, Kwon-Woo Lee, Thermal Fatigue Life Prediction of Gull-Wing Solder Joints in Plastic Thin Small Outline Packages Japanese Journal of Applied Physics. ,vol. 35, ,(1996) , 10.1143/JJAP.35.L1515
Hidekazu Sueyoshi, Tomoyuki Nishida, Solid state bonding of graphite to nickel Materials Transactions. ,vol. 42, pp. 163- 170 ,(2001) , 10.2320/MATERTRANS.42.163
J.H. Lau, Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. ,vol. 19, pp. 728- 735 ,(1996) , 10.1109/96.544363
Christopher J Welham, John Greenwood, Michael M Bertioli, A high accuracy resonant pressure sensor by fusion bonding and trench etching Sensors and Actuators A-physical. ,vol. 76, pp. 298- 304 ,(1999) , 10.1016/S0924-4247(99)00065-5
T. S. Lee, T. P. Choi, C. D. Yoo, Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT Journal of Electronic Packaging. ,vol. 119, pp. 119- 126 ,(1997) , 10.1115/1.2792214
Wai Tuck Chow, Satya N. Atluri, Composite Patch Repairs of Metal Structures: Adhesive Nonlinearity, Thermal Cycling, and Debonding AIAA Journal. ,vol. 35, pp. 1528- 1535 ,(1997) , 10.2514/2.7481
John H. L. Pang, C. W. Seetoh, Z. P. Wang, CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis Journal of Electronic Packaging. ,vol. 122, pp. 255- 261 ,(2000) , 10.1115/1.1286120
S. Ding, I. Erdinc, F.-G. Buchholz, M. Kumosa, Optimization of the adhesive joint Iosipescu specimen for pure shear test International Journal of Fracture. ,vol. 76, pp. 1- 20 ,(1996) , 10.1007/BF00034027
M.N. Charalambides, A.J. Kinloch, F.L. Matthews, Adhesively-bonded repairs to fibre-composite materials II. Finite element modelling Composites Part A-applied Science and Manufacturing. ,vol. 29, pp. 1383- 1396 ,(1998) , 10.1016/S1359-835X(98)00061-X