Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT

摘要: The three-dimensional geometry of a solder joint associated with surface mount electronic packaging process is modeled by employing height function, z = ζ(x, y), and applying the finite element solution procedure. A rigorous formulation based on variational methodologies derived in two-dimensional integral form so that standard numerical techniques for plane problems can be applied. appropriate corresponding procedures are devised. Numerical examples representing circular rectangular pads tested validation developed simulator illustration its overall capability. method presented this paper shows remarkable alternative to complete approach. eliminates difficulties setting up brick meshes or adjusting shape body determine equilibrium soldering joint.