A high accuracy resonant pressure sensor by fusion bonding and trench etching
作者： Christopher J Welham , John Greenwood , Michael M Bertioli
DOI: 10.1016/S0924-4247(99)00065-5
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摘要: … resonant pressure transducer which comprises a `butterfly'-shaped resonator defined by a boron etch stop. This sensor … thinning technology to fabricate an improved sensor design. The …
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B.P. van Drieenhuizen, N.I. Maluf, I.E. Opris, G.T.A. Kovacs, Force-balanced accelerometer with mG resolution, fabricated using Silicon Fusion Bonding and Deep Reactive Ion Etching Sensors. ,vol. 2, pp. 1229- 1230 ,(1997) , 10.1109/SENSOR.1997.635447
John Greenwood, Troy Wray, High accuracy pressure measurement with a silicon resonant sensor Sensors and Actuators A: Physical. ,vol. 37-38, pp. 82- 85 ,(1993) , 10.1016/0924-4247(93)80017-B
P-A Clerc, L Dellmann, F Grétillat, M-A Grétillat, P-F Indermühle, S Jeanneret, Ph Luginbuhl, C Marxer, T L Pfeffer, G-A Racine, S Roth, U Staufer, C Stebler, P Thiébaud, N F de Rooij, Advanced deep reactive ion etching: a versatile tool for microelectromechanical systems Journal of Micromechanics and Microengineering. ,vol. 8, pp. 272- 278 ,(1998) , 10.1088/0960-1317/8/4/003
Jy K. Bhardwaj, Huma Ashraf, Advanced silicon etching using high-density plasmas Micromachining and Microfabrication Process Technology. ,vol. 2639, pp. 224- 233 ,(1995) , 10.1117/12.221279
Young-Ho Cho, Byung Man Kwak, Albert P. Pisano, Roger T. Howe, Slide film damping in laterally driven microstructures Sensors and Actuators A-physical. ,vol. 40, pp. 31- 39 ,(1994) , 10.1016/0924-4247(94)85027-5
FR Blom, S Bouwstra, M Elwenspoek, JHJ Fluitman, Dependence of the quality factor of micromachined silicon beam resonators on pressure and geometry Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. ,vol. 10, pp. 19- 26 ,(1992) , 10.1116/1.586300
W.C. Tang, M.G. Lim, R.T. Howe, Electrostatically balanced comb drive for controlled levitation IEEE 4th Technical Digest on Solid-State Sensor and Actuator Workshop. pp. 23- 27 ,(1990) , 10.1109/SOLSEN.1990.109812
Erno H. Klaassen, Kurt Petersen, J.Mark Noworolski, John Logan, Nadim I. Maluf, Joe Brown, Christopher Storment, Wendell McCulley, Gregory T.A. Kovacs, Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures Sensors and Actuators A: Physical. ,vol. 52, pp. 132- 139 ,(1996) , 10.1016/0924-4247(96)80138-5