Life-Cycle Energy and Global Warming Emissions of CMOS Logic

作者: Sarah B. Boyd

DOI: 10.1007/978-1-4419-9988-7_4

关键词: Global-warming potentialMobile deviceServerTransistorGlobal warmingCentral processing unitCMOSComputer scienceElectrical engineering

摘要: Complementary metal oxide semiconductor (CMOS) is the dominant device structure for digital logic. The central processing unit (CPU) in desktops, laptops, handheld devices and servers, as well nearly all embedded logic (the chips appliances toys) are composed of CMOS transistors. Every one to three years, a new generation or technology node introduced, based on design laws which have been established through industrial collaboration. Due cooperation necessary plan achieve goals each generation, there considerable homogeneity among manufactured by major producers at node. A generic version may thus be used LCA represent products from many different manufacturers.

参考文章(34)
Chris Hendrickson, Arpad Horvath, Satish Joshi, Lester Lave, Economic Input–Output Models for Environmental Life-Cycle Assessment Environmental Science & Technology. ,vol. 32, ,(1998) , 10.1021/ES983471I
Robert E. Franklin, Arthur W. Francis, Gregorio Tarancon, Process for the production of silane ,(1976)
Andrew Joseph Woytek, Daniel Gene Coronell, Howard Paul Withers, Thomas Hsiao-Ling Hsiung, Process for nitrogen trifluoride synthesis ,(1997)
Thomas F Stocker, Dahe Qin, G-K Plattner, Melinda MB Tignor, Simon K Allen, Judith Boschung, Alexander Nauels, Yu Xia, Vincent Bex, Pauline M Midgley, Climate change 2007 : the physical science basis : contribution of Working Group I to the Fourth Assessment Report of the Intergovernmental Panel on Climate Change Published in <b>2007</b> in Cambridge by Cambridge university press. ,(2007) , 10.1017/CBO9781107415324
James Joseph Maloney, John Bernard Saunders, Ravindra Fulchand Pahade, Process for separating methane and nitrogen ,(1986)
Toru Shiino, Hiroshi Onishi, Takayoshi Ueno, Evaluation of electronic components in life cycle assessment Journal of Material Cycles and Waste Management. ,vol. 1, pp. 25- 32 ,(1999) , 10.1007/S10163-999-0002-9
Eric D. Williams, Robert U. Ayres, Miriam Heller, The 1.7 kilogram microchip: energy and material use in the production of semiconductor devices. Environmental Science & Technology. ,vol. 36, pp. 5504- 5510 ,(2002) , 10.1021/ES025643O