Growth of electrolytic copper dendrites and their adhesion to an epoxy resin
作者： Byung K Sun , Thomas J O'Keefe
DOI: 10.1016/S0257-8972(98)00488-5
关键词: Adhesion 、 Metal 、 Adhesive 、 Copper 、 Composite material 、 Dendrite (metal) 、 Electrolyte 、 Materials science 、 Epoxy 、 Thin film
摘要: … to the effect of mechanical interlocking due to high specific area … interlocking or anchoring. The idea of acquiring adhesion promotion through establishment of mechanical interlocking …
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