Strain Sensing Sheets for Structural Health Monitoring Based on Large-Area Electronics and Integrated Circuits

摘要: Accurate and reliable damage characterization (i.e., detection, localization, evaluation of extent) in civil structures infrastructure is an important objective structural health monitoring (SHM). Highly accurate at early stages requires continuous or quasi-continuous direct sensing the critical parameters. Direct deploying dense arrays sensors, to enhance probability that will result signals can be directly acquired by sensors. However, coverage sensors over large areas are relevance represents enormous challenge for current technologies. Large area electronics (LAE) emerging technology enable formation sensor spanning (several square meters) on flexible substrates. This paper explores requirements a sheet SHM based LAE crystalline silicon CMOS integrated circuits (ICs). The contains array thin-film full-bridge resistive strain along with readout, full-system self-powering, communication. Research several presented translating practical applications. includes experimental individual sensor’s response when exposed cracks concrete steel; theoretical performance various geometrical parameters sheet; development necessary power management, sensor-data concept has been experimentally validated, potential provide successful evaluated laboratory setting. A prototype also successfully developed independently characterized laboratory, meeting required specifications. Thus, applications shows promise both terms practicality effectiveness.