Electrocrystallization of metallic thin films on different substrates: Effect of operating parameters
作者： Kheer Sagar Maitry
DOI:
关键词: Grain growth 、 Materials science 、 Substrate (electronics) 、 Deposition (phase transition) 、 Graphite 、 Composite material 、 Scanning electron microscope 、 Thin film 、 Nucleation 、 Metallurgy 、 Crystallinity
摘要: Thin films are two dimensional layers with a thickness usually in the order of nanometers to microns, which is negligible when compared bulk material. play vital role many prospective fields like energy, mechanical and metallurgical solutions. The current work focuses on grain growth, crystallinity induced stress copper thin synthesized by electrodeposition graphite stainless steel (SS) substrates. Cu film deposition was carried out (i) at constant voltage (0.35V) varying temperature (ii) (room) for each substrate. nucleation growth behavior Graphite studied X-ray diffraction (XRD) Scanning Electron Microscopy (SEM). Induced calculated from Stoney formula surface profilometer data. It observed that case fixed tests, low (10°C) not favorable higher increase bath (18 & 20°C). Similarly, (1.3V) resulted high rate than values (0.7 1.0 V). XRD analysis revealed much better substrate SS may be due crystal structure Stress condition obtained tests trend based Tensile detrimental as compressive nature prevents cracking.
参考文章(27)
S.M.S.I. Dulal, Hyeong Jin Yun, Chee Burm Shin, Chang-Koo Kim, Electrodeposition of CoWP film: III. Effect of pH and temperature Electrochimica Acta. ,vol. 53, pp. 934- 943 ,(2007) , 10.1016/J.ELECTACTA.2007.08.006
J. O'm. Bockris, G. A. Razumney, Fundamental aspects of electrocrystallization ,(1967)
Kasturi Lal Chopra, Inderjeet Kaur, Thin film device applications ,(1983)
T.G. Tessier, G.M. Adema, I. Turlik, Polymer dielectric options for thin film packaging applications Proceedings., 39th Electronic Components Conference. pp. 127- 134 ,(1989) , 10.1109/ECC.1989.77738
C. Detavernier, S. Rossnagel, C. Noyan, S. Guha, C. Cabral, C. Lavoie, Thermodynamics and kinetics of room-temperature microstructural evolution in copper films Journal of Applied Physics. ,vol. 94, pp. 2874- 2881 ,(2003) , 10.1063/1.1596366
R.P. Wijesundera, M. Hidaka, K. Koga, M. Sakai, W. Siripala, Growth and characterisation of potentiostatically electrodeposited Cu2O and Cu thin films Thin Solid Films. ,vol. 500, pp. 241- 246 ,(2006) , 10.1016/J.TSF.2005.11.023
M.R. Khelladi, L. Mentar, A. Azizi, A. Sahari, A. Kahoul, Electrochemical nucleation and growth of copper deposition onto FTO and n-Si(1 0 0) electrodes Materials Chemistry and Physics. ,vol. 115, pp. 385- 390 ,(2009) , 10.1016/J.MATCHEMPHYS.2008.12.017
Shuying Cheng, Guonan Chen, Yanqing Chen, Cichang Huang, Effect of deposition potential and bath temperature on the electrodeposition of SnS film Optical Materials. ,vol. 29, pp. 439- 444 ,(2006) , 10.1016/J.OPTMAT.2005.10.018
Allen J Bard, Larry R Faulkner, Henry S White, Electrochemical Methods: Fundamentals and Applications ,(1980)
F Spaepen, Interfaces and stresses in thin films Acta Materialia. ,vol. 48, pp. 31- 42 ,(2000) , 10.1016/S1359-6454(99)00286-4