Thermodynamics and kinetics of room-temperature microstructural evolution in copper films
作者： C. Detavernier , S. Rossnagel , C. Noyan , S. Guha , C. Cabral
DOI: 10.1063/1.1596366
关键词:
摘要: We studied the energetics and kinetics of microstructural evolution in copper films by estimating magnitude various possible driving forces for change that can be present as-deposited film. A force at least 100 J/cm3 is required to account speed which grain boundaries move room temperature. This value cannot accounted only considering minimization grain-boundary energy effects related surface strain as main mechanisms. It suggested additional needed explain grains recrystallize, originating from a high density defects within grains.
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