Effects of grain orientation on hillock formation and grain growth in aluminum films on silicon substrates

作者: J.E. Sanchez , E. Arzt

DOI: 10.1016/0956-716X(92)90513-E

关键词:

摘要:

参考文章(10)
Hai P. Longworth, C. V. Thompson, Abnormal grain growth in aluminum alloy thin films Journal of Applied Physics. ,vol. 69, pp. 3929- 3940 ,(1991) , 10.1063/1.348452
P. Chaudhari, Hillock growth in thin films Journal of Applied Physics. ,vol. 45, pp. 4339- 4346 ,(1974) , 10.1063/1.1663054
Nils Kristensen, Fredric Ericson, Jan‐Åke Schweitz, Ulf Smith, Grain collapses in strained aluminum thin films Journal of Applied Physics. ,vol. 69, pp. 2097- 2104 ,(1991) , 10.1063/1.348736
William D. Nix, Mechanical properties of thin films Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 20, pp. 2217- 2245 ,(1989) , 10.1007/BF02666659
Nils Kristensen, Fredric Ericson, Jan-Åke Schweitz, Ulf Smith, Hole formation in thin aluminium films under controlled variation of strain and temperature Thin Solid Films. ,vol. 197, pp. 67- 83 ,(1991) , 10.1016/0040-6090(91)90222-J
Alfred J. Griffin, Franz R. Brotzen, Clyde Dunn, Hall-petch relation in thin film metallizations Scripta Metallurgica. ,vol. 20, pp. 1271- 1272 ,(1986) , 10.1016/0036-9748(86)90046-3
C. V. Thompson, Secondary grain growth in thin films of semiconductors: Theoretical aspects Journal of Applied Physics. ,vol. 58, pp. 763- 772 ,(1985) , 10.1063/1.336194
Donald S Gardner, TL Michalka, KC Sawswat, TW Barbee, JP McVittie, JD Meindl, None, Layered and Homogeneous Films of Aluminum and Aluminum/Silicon with Titanium and Tungsten for Multilevel Interconnects IEEE Journal of Solid-State Circuits. ,vol. 20, pp. 94- 103 ,(1985) , 10.1109/JSSC.1985.1052281
M.F. Doerner, D.S. Gardner, W.D. Nix, Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques Journal of Materials Research. ,vol. 1, pp. 845- 851 ,(1986) , 10.1557/JMR.1986.0845