Non-contact determination of joint integrity between a TSV die and a package substrate

摘要: A non-contact voltage contrast (VC) method of determining TSV joint integrity after partial assembly. die is provided including TSVs that extend from a frontside the to tips on bottomside die. At least some (contacting TSVs) are attached pads top surface multilayer (ML) package substrate. The ML substrate carrier blocks electrical access Two or more nets groups contacting tied common within charged particle reference beam directed selected first net and primary then rastered across in net. VC signals emitted detected, for determined signals.