Semiconductor fabrication method and system
作者： Swarnal Borthakur
DOI:
关键词:
摘要: Embodiments of the present invention are generally directed to a method for manufacturing semiconductor device. In one embodiment, includes providing substrate that via or interconnect. this also forming sealed array, in which such an array attaching carrier first surface form cavity between and substrate. Further, embodiment redistribution layer on over second Devices systems having attached disclosed.
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