Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices
作者： Byung-lyul Park , Hyun-Soo Chung , Kyu-Ha Lee , Ho-Jin Lee , Pil-Kyu Kang
DOI:
关键词:
摘要: A semiconductor device including a lower layer, an insulating layer on first side of the interconnection structure in via layer. The protrudes into and structure.
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