Semiconductor device with improved heat dissipation, and a method of making semiconductor device
作者： Hideaki c o Fujitsu Limited Yoshimura
DOI:
关键词:
摘要: A semiconductor device includes a chip, heat dissipation member for dissipating generated by the and coupling which thermally couples chip to member, wherein is made of metal deformable absorb stress between being joined through metal-metal bonding.
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