Metal bumps for cooling device connection
作者： Perre Kao , Chun-Jen Chen , You-Hua Chou , Yi-Jen Lai
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摘要: The mechanisms for forming metal bumps to connect a cooling device (or heat sink) described herein enable substrates with devices dissipate generated more efficiently. In addition, the allow customization of bump designs meet needs different chips. Further, usage between semiconductor chip and enables advanced by passing fluid bumps.
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