Introduction to microelectronic fabrication

摘要: (NOTE: Each chapter concludes with Summary, References, and Problems.) Preface. 1. An Overview of Microelectronic Fabrication. A Historical Perspective. Monolithic Fabrication Processes Structures. Metal-Oxide-Semiconductor (MOS) Processes. Basic Bipolar Processing. Safety. 2. Lithography. The Photolithographic Process. Etching Techniques. Photomask Exposure Systems. Sources. Optical Electron Microscopy. Further Reading. 3. Thermal Oxidation Silicon. Modeling Oxidation. Factors Influencing Rate. Dopant Redistribution During Masking Properties Silicon Dioxide. Technology Oxide Quality. Selective Shallow Trench Formation. Thickness Characterization. Process Simulation. 4. Diffusion. Diffusion Mathematical Model for Coefficient. Successive Diffusions. Solid-Solubility Limits. Junction Formation Sheet Resistance. Generation-Depth Impurity Profile Measurement. Gettering. 5. Ion Implantation. Implantation Technology. Depth Channeling, Lattice Damage, Annealing. Source Listing 6. Film Deposition. Evaporation. Sputtering. Chemical Vapor Epitaxy. 7. Interconnections Contacts. in Integrated Circuits. Metal Contact Diffused Interconnections. Polysilicon Buried Silicides Multilayer-Contact Liftoff Multilevel Metallization. Copper Interconnects Damascene 8. Packaging Yield. Testing. Wafer Thinning Die Separation. Attachment. Wire Bonding. Packages. Flip-Chip Tape-Automated-Bonding 9. MOS Integration. Device Considerations. Transistor Layout Design Rules. Complementary (CMOS) on Insulator. 10. Junction-Isolated Structure. Current Gain. Transit Time. Basewidth. Breakdown Voltages. Other Elements SBC Advanced Isolation BICMOS. 11. Microelectromechanical Systems-MEMS. Mechanical Bulk Micromachining. Etchants. Surface High-Aspect-Ratio Micromachining: LIGA Molding IC Compatibility. Answers to Selected Problems. Index.