Thermomechanical behaviour of environmentally benign Pb-free solders

摘要: Electronic packaging is a critical part of products such as computers, cellular phones, automotive components and other electronic devices. The package must be tailored to incorporate many input/output interconnects possible, in limited amount space. Until recently, most solder balls were made eutectic Pb–Sn alloy, because its low melting point, excellent wetting characteristics adequate creep thermal fatigue strength. potential health hazards associated with the toxicity lead are significant. Given widespread use manufacture assembly circuit boards, development reliability new Pb-free solders crucial for successful substitution these materials electronics industry. Pbfree alloys complex various important microstructural attributes. These include nanoscale precipitates Ag3Sn Sn–Ag–Cu or Sn–Ag alloys, well Cu6Sn5 intermetallic formed at interface between Cu metallisation. mechanical behaviour extremely joints retain their integrity under myriad conditions creep, fatigue, shock drop resistance. A significant work has been carried out on monotonic shear, resistance materials. An area research vibration solders. developments all areas critically examined this paper.