作者: A.S.M.A. Haseeb , Y.M. Leong , M.M. Arafat
DOI: 10.1016/J.INTERMET.2014.05.011
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摘要: Abstract Driven by the necessity to improve reliability of lead free electronic products and trend towards miniaturization, researchers are putting intense efforts properties Sn based solders. The present work investigates effects Zn nanoparticle addition Sn-3.5Ag (SA) alloy through paste mixing on interfacial structure between solder copper substrate during reflow. Results show that nanoparticles does not alter morphology intermetallic compounds although they substantially suppress their growth. seen be most efficient compared with Co Ni in suppressing growth Cu 3 layers. It is suggested exert influence an in-situ dissolution alloying effect.