Laminated, sacrificial-poly MEMS technology in standard CMOS
作者： D.F Guillou , S Santhanam , L.R Carley
DOI: 10.1016/S0924-4247(00)00374-5
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摘要: Abstract We present a micro-machining technology which enables MEMS fabrication on standard CMOS with very dense electrical/mechanical integration. Micro-mechanical structures are fabricated alongside circuits 0.5-μm 3-metal dice using four maskless dry-etch steps. The resulting laminated beams made of metal and dielectric layers. Multi-conductor mechanical can carry multiple signals for actuation sensing. Narrow vertical lateral gaps enable efficient XYZ electrostatic fine capacitive position Experiments show that be integrated 1.5 μm away from signal-processing circuits, in low parasitics, good system performance, small die size.
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sci-hub.se 参考文章(22)
Hasnain Lakdawala, Gary K. Fedder, ANALYSIS OF TEMPERATURE-DEPENDENT RESIDUAL STRESS GRADIENTS IN CMOS MICROMACHINED STRUCTURES ,(1999)
Michael William Putty, A Maicromachined vibrating ring gyroscope Solid-State Sensors and Actuator Workshop. pp. 213- 220 ,(1994)
S. J. H. Brader, A. J. van Roosmalen, J. A. G. Baggerman, Dry Etching for VLSI ,(1991)
T.A. Roessig, J. H, R.T. Howe, A.P. Pisano, Surface-micromachined 1MHz oscillator with low-noise Pierce configuration 1998 solid state sensor and actuator workshop, Hilton Head, SC (United States), 1 Jun 1998. ,(1998) , 10.31438/TRF.HH1998.76
L. Richard Carley, Suresh Santhanam, Gary K. Fedder, Michael L. Reed, Microelectromechanical structure and process of making same ,(1996)
Wolfgang Kuehnel, Steven Sherman, A surface micromachined silicon accelerometer with on-chip detection circuitry Sensors and Actuators A-physical. ,vol. 45, pp. 7- 16 ,(1994) , 10.1016/0924-4247(94)00815-9
Davey Wijngaards, Marian Bartek, Reinoud F. Wolffenbuttel, Silicon ic process compatible thin metal film post-processing module Sensors and Actuators A-physical. ,vol. 68, pp. 419- 428 ,(1998) , 10.1016/S0924-4247(98)00051-X
Christofer Hierold, Andreas Hildebrandt, Ulrich Na¨her, Thomas Scheiter, Bernd Mensching, Max Steger, Reinhard Tielert, A pure CMOS surface-micromachined integrated accelerometer Sensors and Actuators A-physical. ,vol. 57, pp. 111- 116 ,(1996) , 10.1016/S0924-4247(97)80101-X
M. Parameswaran, H.P. Baltes, Lj. Ristic, A.C. Dhaded, A.M. Robinson, A new approach for the fabrication of micromechanical structures Sensors and Actuators. ,vol. 19, pp. 289- 307 ,(1989) , 10.1016/0250-6874(89)87080-5
G.K. Fedder, S. Santhanam, S.C. Reed, M.L., Eagle, D.F. Guillou, M.S.-C. Lua, L.R. Carley, Laminated high-aspect-ratio microstructures in a conventional CMOS process Sensors and Actuators A-physical. ,vol. 57, pp. 103- 110 ,(1996) , 10.1016/S0924-4247(97)80100-8