作者: Suda Yasuo , Yoshizawa Tetsuo , Otaka Keiji , Sato Toshiaki , Onuki Ichiro
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摘要: PURPOSE:To prevent the deformation even when external force is added using a thinly formed lead frame by method wherein hole to be used for positioning provided on protruded part extended from an element-placing part, and supported light-transmitting resin at least in two directions. CONSTITUTION:An optical semiconductor element 11 placed placing of having 2 10, after have been connected metal fine wire, package 6 constituted sealing with epoxy which light transmitting one. Then, 3 almost center frame, three Pertaining retention arm 5 2, anchor 4 thereon, are embedded resin. As result, generating coming can prevented, reliability machine device mounted also enhanced.