Die bond touch down detector
作者： Ricardo Jorge Silverio de Magalhaes Machado , Andre Gil Martins Cardoso
DOI:
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摘要: A die bond touch down detector (20) includes a strain gauge circuit (22) having plurality of gauges (12) formed into wheatstone bridge configuration. The are mounted on head (10) and measure detect deformations the (10). generates differential output signal in response to detected by (12). is amplified, filtered, converted digital format for processing microcontroller (36). (36) performs calibration, display formatting, generation. provides real time monitorization, automatic force applied information
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