Semiconductor die bonder

摘要: In a die bonder for use in bonding semiconductor dice to pads, plurality of be bonded pads are placed first horizontal plane on movable pedestal beneath second which the located. A is picked up and transferred from holding tray pad properly positioned plane. The located by placing it light beam spotlight. contained support structure - typically lead frame strip automatically indexed along heating rail such that once each cycle machine operation receive die. picking transferring moving powered through five cams mounted single shaft turn driven motor. motor shut off twice selected but variable period time allow rate adjusted operator proficiency.