Bonding a beam leaded device to a substrate

作者: Joseph A Santangini

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参考文章(7)
Wingrove Gerald Alan Spenser, Weissenstern Mark, Semiconductor device assembly method ,(1965)
Matthew E Hill, Clamp for vulcanizing patches ,(1936)
Robert E Bowser, Howard S Best, Process for joining transistor chip to printed circuit ,(1964)