Multiple point bonding apparatus
作者： Boris J Speransky , Jerry J Whitman , Jr Cecil A Lasch
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lens.org 参考文章(3)
Walter G Johnson, Jr Cecil A Lasch, Thermocompression lead bonding aparatus ,(1960)
Plante Clarence A La, Work-supporting apparatus for welding machines ,(1945)
Thomas L Angelucci, Soffa Albert, Method for mounting and bonding semiconductor wafers ,(1962)