Automatic bonding apparatus with multiple bonding heads

摘要: In apparatus for automatically wiring circuit boards in a point-to-point operation, continuous supply of insulated wire extends through an opening the bonding tip. Circuit are positioned on table, one board beneath each heads. A digital controller positions table so that heads aligned with solder pads boards. control system head responds to signals from controller. Each operates lower into contact pad, selectively apply heat pad reflow portion and raise its normal position. The also electrical continuity checks determine if bond has been properly made continuously monitor stripped insulation which might cause short circuits. After is made, mechanically stressed insure required mechanical strength.