Ceramic carrier transport for die attach equipment

摘要: An aligning and positioning system for a bonder including bond sensor sensing the X, Y θ coordinates of substrate at bonding location die on transport. A controller correlates sensed from sensors adjusts relative to each other place preselected site substrate. The Z coordinate surface substrate, as well its planarity, may be by optical sensor. X are adjusted transport is adjusted. pattern recognition used with determine quality control prior bonding, paste or after bonding. In calibration phase, sensor, magnification factor two also correlated.