Method and apparatus for solder coating of leads

作者: Naokatsu Kojima , Shinichi Makino

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摘要: A pair of solder coating rolls are disposed hori­zontally adjacent one another for rotation about parallel horizontal axes, and spaced apart to define a narrow vertically-oriented nip therebetween accommodating lead frame therein. Lower parts the contact bath, counter carries upwardly on periphery create small pool at upper end nip. The is driven vertically through nip, which has minimal dimension greater than thickness. linear speed different from, preferably slower than, peripheral rolls. This enables preheating surface due its longer exposure with hot coats rolls, thereby improving wetability surface. At same time, this upward movement liquid permits high quality uniformity be applied frame.

参考文章(20)
Monroe Jr Raymond, Moore Tom E, Apparatus for applying solder coatings to surfaces ,(1958)
John W Andersen, Harold I Reynolds, Gerald V Marcell, Edge coating of flat wires NASA Marshall Space Flight Center Report. ,(1966)
Shigeaki Kataoka, Solder coating apparatus ,(1987)
Richard J Merwarth, Ford J Brown, David L Rooz, Apparatus for forming layers of fusible metal on articles ,(1972)
Claud H Fogle, Hamburger Mark, Apparatus for producing rolls of nonfraying material ,(1924)
Toshihiro Yabuki, Nobuyuki Yamane, Toshimasa Tanichi, Takumi Tanigawa, Shigenori Nakagawa, Method for coating lead-attached electronic device ,(1974)