Individual chip joining machine

摘要: An individual chip joining machine is designed primarily to bond a single multi-chip substrate. The includes an X-Y table for moving substrate locate site beneath probe. probe serves pick up and either place it on the or remove therefrom further heat join by solder reflow melt allow be removed. mounted Z direction placement mechanism that also means backed off fixed distance from chip, once has been placed preparatory thereto. A second heater heats bias temperature, this heating being controlled through use of surrogate having thermocouple attached