Method of and apparatus for selective solder reflow
作者： D Prince , R Reilly , J Papadopoulos
DOI:
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摘要: A method of selective solder reflow in which an article to be reflowed is heated for a period time sufficient melt the solder, and at least one deposit not cooled prevent that from melting. In order reduce temperature gradients article, cooling delayed until heating has been applied.
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