Infrared apparatus for infrared soldering components on circuit boards
作者： Stanley D. Entwistle , George W. R. Goodyear , Gabriel Marcantonio , Raymond K. Kelly , Timothy Sobolak
DOI:
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摘要: In infrared soldering of components onto circuit boards, where such as leaded are first soldered on one surface a board and then additional the other surface, it is problem that solder joints arrangement may melt during second step. Also, heat reflected from apparatus can raise temperature above defined maximum. invention, sink provided for absorbing source when no present, already soldered, Usually path boards below of, not in contact with, boards.
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