Composite pallet for a vector transient reflow process
作者： Lakhi Goenka , Mark Tor , Brenda Nation , Peter Sinkunas
DOI:
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摘要: The present invention involves a composite pallet for substrate of printed circuit board vector transient reflow process. includes heat conductive layer sinking means from the and insulative adjacent to shield absorb layer. has first second opposite surfaces. surface is configured receive disposed thereon diffuse during surface.
lens.org 参考文章(8)
Toshiharu Shibo, Isao Kawaguchi, Electronic unit soldering apparatus ,(1998)
Peter Joseph Sinkunas, Lakhi N. Goenka, System and method for mounting electronic components onto flexible substrates ,(2001)
Toshimichi Ouchi, Masanori Takahashi, Riichi Saito, Electrode connection method ,(1997)
Stanley D. Entwistle, George W. R. Goodyear, Gabriel Marcantonio, Raymond K. Kelly, Timothy Sobolak, Infrared apparatus for infrared soldering components on circuit boards ,(1986)
Martin I. Soderland, Francis C. Nutter, Richard J. Nihan, Apparatus and method for solder reflow bottom cooling ,(1996)
D Prince, R Reilly, J Papadopoulos, Method of and apparatus for selective solder reflow ,(1970)
Stuart D. Downes, Methods and apparatus for installing a module on a circuit board using heating and cooling techniques ,(2000)