Apparatus for positioning and bonding

摘要: This patent discloses a method and apparatus for aligning joining semiconductor chip to substrate or carrier. The first then bonding the comprises system which includes alignment means, immediately below means there being receiving is movable so as permit of in predetermined position relative means. A second cooperates with vacuum-operated receiver. moved until superimposed are provided press into contact substrate. heater located heats while held against rotated arcuately, bearing causing scrubbing action inhibit presence voids bond interface.