Method of picking up and bonding semiconductor wafers to a carrier
作者： Earl A Zanger , Peter R Szasz
DOI:
关键词:
摘要: A MECHANIZED METHOD OF PICKING UP PARTIALLY PREORIENTED SEMICONDUCTOR WAFER FROM PLURALITY WAFERS ON TRAY, ORIENTING THE DURING STEP IT AND SIMULTANEOUSLY PLACING BONDING CARRIER IN DESIRED PREDETERMINED POSITION.
lens.org 参考文章(0)