Solder Bump Flip-Chip Replacement Technology on Ceramic Carriers
作者： Karl J. Puttlitz , Kathleen A. Stalter
DOI: 10.1007/978-1-4615-1389-6_9
关键词:
摘要: The industry has focused on replacing packaged chips such as pin-in-hole (PIH) and surface-mount components (SMT) cards or boards. Components which do not pass electrical test inspection are removed from but single chip packages. In some instances, plastic molded packages, removal is a viable option.
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