Apparatus and method for heating a board-mounted electrical module for rework
作者： Christian Robert Le Coz , Craig Grant Heim , Russell H. Lewis
DOI:
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摘要: An apparatus for heating a module mounted on card includes chamber adapted to receive the and module, nozzle surround provide flow of heated gas thereover, support surface bottom immediately underlying module. The method removing replacing preheating prior contact sites solder reflow temperature also replacement an equilibrium increasing temperature. embodying present invention effectively addresses problem providing faster cycle, more even distribution across card.
google.de 参考文章(15)
Carr Everett Quentin, Component chip mounted on substrate with heater pads therebetween ,(1964)
Herbert Wenskus, Karl Schink, Robert H. Meyen, Karl J. Puttlitz, Individual chip joining machine ,(1977)
Ronald A. Beck, Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies ,(1982)
Louis A. Abbagnaro, Bobby L. Mason, Nozzle structure for soldering and desoldering ,(1987)
Carl R. Scrogum, Steven R. Stach, Surface mount assembly repair terminal ,(1987)
Clifford S. Lasto, Jeffrey S. Duhaime, Process and apparatus for attaching/deataching land grid array components ,(1993)
Ronald J. Moore, Joseph Funari, Apparatus for soldering a semiconductor device to a circuitized substrate ,(1992)
Czes A. Ruszowski, Reflow minioven for electrical component ,(1994)
Alan D. Vogel, Carl B. Zovko, Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards ,(1983)
Charles W. Eichelberger, Robert J. Wojnarowski, Method and apparatus for removing components bonded to a substrate ,(1991)