Reflow soldering apparatus and reflow soldering method
作者： Hideaki Yoshimura
DOI:
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摘要: A reflow soldering apparatus for a first component mounted on substrate with solder having melting point and second the higher than point. The includes heat source substantially uniformly heating substrate, capsule enclosing component, vacuum pump decreasing pressure in capsule. of can be lowered by operating to decrease given amount, so that reflow-soldered at same temperature.
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