Method of and apparatus for mounting an electronic part to a substrate
作者： Kazuyuki Ikura , Koichi Shimamura
DOI:
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摘要: An apparatus 1 for mounting an electronic part to a substrate according the present invention includes: unit 12 11 10 ; supplying 17 predetermined position; 14 return transporting 32 , on which has been mounted by carrier 100 detachably holds supplied from and heat capacity of value or higher; heating moving 101 transport start position 13 feed while 100.
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