Reworking methods and apparatus for surface mounted technology circuit boards

摘要: Methods and apparatus for reworking printed circuit boards carrying surface mounted components by removing faulty or improperly connected replacing them with new components, incorporate an X-Y table clamping the board target component positioned on a vertical working axis, using heated, component-gripping vacuum head movably movement angularly rotatable pivoting adjustment, jets of hot compressed air directed at component's peripheral terminal leads, bringing to solder-melting temperature, reversible angular drive motor deliver torque gently abruptly in reciprocating fashion, producing over small angle rotation, shearing adhesive which bonds place, all under control programmed microcomputer governing operating sequences selected initiated operator. The same mechanisms techniques are employed position solder place.