作者: David C. Jacks , Randall R. Walston
DOI:
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摘要: In one aspect, a device for attaching component to circuit board is provided, comprising held in holder and contact heater that heats the on by conducting heat through component. further wand which manually moved onto another invention provides method board, steps of gripping with heater; placing board; heating contact, wherein conducted melts solder under attaches board.