Method and apparatus for component removal
作者： Nitin Gupta , Pranamesh Das , Khadak Singh , Abdul Rehman
DOI:
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摘要: The proposed invention relates to an apparatus and a method of separating all the parts including but not limited electronic components, mechanical electromechanical modules etc either individually or in sections modular from main input PCB. is for component removal during recycling device comprising combination isothermal system; heating achieve desired range temperature within said at least one system handling object being recycled; selective separation components removed.
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