Method of fabricating electronic circuit device and apparatus for performing the same method
作者： Tetsuya Hayashida , Mitugu Shirai , Ryohei Satoh , Masahide Harada , Toru Nishikawa
DOI:
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摘要: In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material bonding pad, for example, are aligned in oxidizing atmosphere. Then is heated nonoxidizing atmosphere to melt and bond members. Cleaning pad performed by sputter-cleaning, laser cleaning, mechanical polishing, cutting.
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