Method and apparatus for testing integrated circuit chips
作者： Kibby Barth Horsford , Gary Ray Hill , Gordon Charles Osborne , Michael David Lowell , George Charles Correia
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摘要: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor have I/O contacts. provided with an interposer that has contacts corresponding to the on chip. Both chip can be any known type including metal ball, bumps, or tabs may dendritic surfaces. are first brought into relative loose temporary contact then a compressive force greater 5 grams per applied good electrical Testing of performed. tests include heating as well application signals After removed from substrate.
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