Integrated circuit chip repair tool

作者： W C Ward

DOI:

关键词: Flip chip 、 Integrated circuit 、 Chip 、 Engineering 、 Overheating (electricity) 、 Electrical engineering 、 Temperature sensing 、 Single chip 、 Optoelectronics 、 Pickup

摘要: An integrated circuit chip repair tool for bonding or removing reflow soldered chips on multi-chip substrates having pickup means to move toward away from a substrate, flame heating apply concentrated source of heat single without overheating adjacent chips, infrared temperature sensing measure the heated and control responsive automatically discontinue by extinguishing activate means.