Method and apparatus for repairing printed circuits
作者： A Burghart , J Kieffer , G Wallace , D Houser
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摘要: A method and apparatus for repairing an open or void in a printed circuit line on board wherein the is positioned with underneath bonding head metallic ribbon material over open, thermal compression bonded to one side of cut length, then other open.
lens.org 参考文章(1)
W C Ward, Integrated circuit chip repair tool ,(1971)