Flip chip bonder
作者： Kazuhisa Arai , Takashi Mori , Hideyuki Sandoh , Shinichi Namioka
DOI:
关键词: Chip 、 Substrate (printing) 、 Engineering 、 Die (integrated circuit) 、 Cutting tool 、 Electronic engineering 、 Mechanism (engineering) 、 Optoelectronics 、 Flip chip 、 Electrode 、 Thermal copper pillar bump
摘要: A flip chip bonder including a substrate holding mechanism and die for bonding semiconductor having plurality of electrodes projecting from its front surface to held on the means. The includes chuck table, take-out area an electrode cutting area, tool table arranged in make them uniform height, take-in mechanism, conveying mechanism.
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