Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
作者： Takashi Kitae , Seiji Karashima , Takashi Ichiryu , Yoshihisa Yamashita , Seiichi Nakatani
DOI:
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摘要: In a flip chip mounting method, circuit board (213) and semiconductor (206) are held, aligned by being held at prescribed interval, the heated to temperature where solder resin composition (216) composed of powder (214) (215) melts, is supplied capillary phenomenon. At time hardening (215), molten in permitted move interval which connecting terminal (211) an electrode (207) electrically connected permitting self-collect grow. Thus, next generation can be mounted on board, method having high productivity reliability, body apparatus employing such provided.
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