Recognition device, bonding device, and method of manufacturing a circuit device

摘要: The present invention solves a problem that in wire bonding process, an inert gas used for prevention of oxidation substrate gave rise to shimmer due the temperature difference during bonding, thereby degrading precision pattern recognition. With this invention's device 21, shielding lids 31, 32, and 33 are disposed at upper lower parts ring illumination 25 part lens barrel 29. Shimmer 37 nitrogen blows out from working hole 24 can thus be prevented entering inside 25, especially by lid 31 25. As result, recognition camera improved μm order improved.