作者: Hiroshi Fujita , Hiroshi Yamada
DOI: 10.1143/JPSJ.29.132
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摘要: Multiplication processes of dislocations in thick foils are continuously observed by high-voltage electron microscopy. When an applied stress reaches a certain value, which is lower than the apparent yield stress, some segments grown-in existing on single slip plane become active proportion to their length. Each them emits 10∼20 through Frank-Read mechanism. Pole-dislocations them, however, also moved out with increase stress. These closely related cross-slip. With main process multiplication switched that double cross-slip type, whose source number increases exponentially increasing This stage responsible phenomenon. Besides these, generation at stress-concentrated parts, such as voids, crack tips so on, observed.