Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface
作者： Y. Liu , J. Wang , L. Yin , P. Kondos , C. Parks
DOI: 10.1007/S10800-008-9618-Z
关键词:
摘要: … with Cu plated in the presence of an unspecified additive in comparison with “no additive” … A GPS was formulated in our lab to consist of 0.26 M CuSO 4 · 5H 2 O (Sigma-Aldrich), 2 MH 2 …
springer.com
sci-hub.se 参考文章(29)
Nasser Kanani, Electroplating: Basic Principles, Processes and Practice ,(2005)
Tz-Cheng Chiu, Kejun Zeng, R. Stierman, D. Edwards, K. Ano, Effect of thermal aging on board level drop reliability for Pb-free BGA packages electronic components and technology conference. ,vol. 2, pp. 1256- 1262 ,(2004) , 10.1109/ECTC.2004.1320275
Peter Borgesen, Liang Yin, Pericles Kondos, Donald W. Henderson, Greg Servis, Joseph Therriault, Ju Wang, K. Srihari, Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids! electronic components and technology conference. pp. 136- 146 ,(2007) , 10.1109/ECTC.2007.373788
Kejun Zeng, Roger Stierman, Tz-Cheng Chiu, Darvin Edwards, Kazuaki Ano, K. N. Tu, Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability Journal of Applied Physics. ,vol. 97, pp. 024508- ,(2005) , 10.1063/1.1839637
Ibro Tabakovic, Steven Riemer, Venkateswara Inturi, Paul Jallen, Arthur Thayer, Organic Additives in the Electrochemical Preparation of Soft Magnetic CoNiFe Films Journal of The Electrochemical Society. ,vol. 147, pp. 219- 226 ,(2000) , 10.1149/1.1393178
T. P. Moffat, D. Wheeler, M. D. Edelstein, D. Josell, Superconformal film growth: mechanism and quantification Ibm Journal of Research and Development. ,vol. 49, pp. 19- 36 ,(2005) , 10.1147/RD.491.0019
C. Y. Liu, K. N. Tu, T. T. Sheng, C. H. Tung, D. R. Frear, P. Elenius, Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization Journal of Applied Physics. ,vol. 87, pp. 750- 754 ,(2000) , 10.1063/1.371967
M. B. Vukmirovic, N. Vasiljevic, N. Dimitrov, K. Sieradzki, Diffusion-Limited Current Density of Oxygen Reduction on Copper Journal of The Electrochemical Society. ,vol. 150, ,(2003) , 10.1149/1.1526554
T.E. Konstantinova, V.I. Zaitsev, Reversible temper embrittlement in a steel deformed under high pressure Materials Science and Engineering. ,vol. 49, pp. 1- 6 ,(1981) , 10.1016/0025-5416(81)90127-0
Wenge Yang, Robert W. Messler, Lawrence E. Felton, Microstructure evolution of eutectic Sn-Ag solder joints Journal of Electronic Materials. ,vol. 23, pp. 765- 772 ,(1994) , 10.1007/BF02651371